Heat dissipation module with heat pipes

ABSTRACT

A heat dissipation module including heat pipes. The heat dissipation module includes a seat with grooves, heat pipes and two fin assemblies. The heat pipes are secured in the grooves at a first end and extend at the second end thereof. A first fin assembly with parallel first fins is soldered to the seat, covering the grooves and heat pipes. A second fin assembly with parallel second fins is secured to the cantilevered end of the heat pipes.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat dissipation module, and inparticular to a heat dissipation module using heat pipes to increaseheat transfer efficiency thereof.

2. Description of the Related Art

Presently, CPUs for conventional barebone servers consume excessivepower and generate considerable heat. Space reserved inside the serverfor a heat dissipation module, however, is limited.

Heat sinks are a common component in conventional heat dissipationmodules. Conventional heat sinks comprise aluminum extrusion type orcopper adhering type, mounted directly on a chip or CPU and utilize theflow provided by preset passages or fans mounted thereon to dissipateheat. In order to increase stability of conventional severs, heat sinksmust continue to dissipate heat even when some of system fansmalfunction. Hence, there is a need for a better heat sink with higherheat dissipation efficiency for conventional barebone servers.

SUMMARY OF THE INVENTION

Accordingly, an object of the invention is to provide a heat sink withhigher heat dissipation efficiency for conventional barebone servers.

Accordingly, the present invention provides a heat dissipation modulewith heat pipes. The heat dissipation module comprises a seat withgrooves, heat pipes and two fin assemblies. The seat is disposeddirectly on a heat source. The first fin assembly with parallel firstfins is disposed on the seat, covering the grooves. The second finassembly with parallel second fins is disposed on a side of the firstfin assembly. Each heat pipe comprises a first end disposed in thegrooves, covered by the first fin assembly, and a second end extendingfrom the grooves and passing through the second fin assembly.

In a preferred embodiment, the heat pipes are soldered in the grooves,perpendicular to the first and second fins. The first fin assembly issoldered on the seat. The second fin assembly is soldered on thecantilevered ends of the heat pipes. The seat, heat pipes, first finassembly and second fin assembly comprise copper or aluminum.

The heat dissipation module of the present invention utilizes heat pipesto transfer heat from a first fin assembly to an additional second finassembly, increasing the effective area of the heat dissipation module.

Furthermore, the additional second fin assembly can be arranged in aresidual area of a system or a position with better dissipationefficiency. The first and second fin assemblies are connected by heatpipes, thus improving heat dissipation efficiency of the heatdissipation module and effectively utilizing the limited space providedin a conventional sever.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention can be more fully understood by reading thesubsequent detailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1 is an exploded view of a heat dissipation module of presentinvention; and

FIG. 2 is a schematic view of the heat dissipation module.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is an exploded view of a heat dissipation module of the presentinvention. In FIG. 1, the heat dissipation module 10 comprises a seat20, heat pipes 24 and two fin assemblies 30, 40. The seat 20 is a metalplate directly disposed on a heat source 2, such as a CPU, graphic chipor other chips. The seat 20 comprises a plurality of parallel grooves 22with width and depth similar to the bore diameter of the heat pipes 24.The heat pipes 24 are hollow elliptic pipes with low-pressure heatconductive liquid therein, transferring heat by convection. The heatpipes 24 are secured in the grooves 22 at one end and protrudes from thegrooves 22.

The first fin assembly 30 is disposed on the seat 20, covering thegrooves 22 and heat pipes 24, and comprises a plate 32, a plurality ofparallel first fins 34 and two fixing protectors 36. The first fins 34are adhered or soldered on the plate 32. The fixing protectors 36prevent damage to the edges of the first fins 34.

The second fin assembly 40 comprises a plate 42, a plurality of parallelsecond fins 44 and two fixing protectors 46. The second fins 44 areadhered or soldered on the plate 42. The fixing protectors 46 preventdamage to the edges of the second fins 44. Each second fin 44 hasthrough holes 48 for access to the cantilevered ends of the heat pipes24, such that the second fin assembly 40 can be soldered thereon.

FIG. 2 shows the heat dissipation module of the invention. In FIGS. 1and 2, when fabricating the heat dissipation module 10, the heat pipes24 are first soldered in the grooves 22, and solder is applied on thesurface of the seat 20 and the cantilevered ends of the heat pipes 24.The first and second fin assemblies 30, 40 are disposed on the seat 20and the cantilevered ends of the heat pipes 24. The entire module 10 isplace in an oven, securing the first and second fin assemblies 30, 40thereon by baking. After fabrication, the heat dissipation module 10 isfixed on a printed circuit board 1, the bottom surface of the seat 20contacting the chip 2, by the screws 28 passing through the openings 26thereof. Thus, the heat dissipation module 10 can dissipate heatgenerated by the chip 2.

In order to increase the heat dissipation efficiency, the seat 20, heatpipes 24, first and second fin assemblies 30 and 40 comprise copper oraluminum. Conventional heat dissipation paste can be applied between thechip 2 and the seat 20 and in the grooves 22 to facilitate heatconduction. The heat pipes 24 are perpendicular to the first fins 34 andsecond fins 44, preventing obstruction of provided flow.

Furthermore, the heat pipes 24 can be directly soldered on the topsurface of the seat 20. The plate 20 and the first fins 34 comprisenotches, such that the first fin assembly 30 can be secured on the seat20 without forming grooves 22.

The additional second fin assembly 40 can be arranged in a residual areaof a system or a position with better dissipation efficiency. The firstand second fin assemblies 30 and 40 are connected by heat pipes 24,transferring heat, such that heat dissipation efficiency of the heatdissipation module 10 can be improved, and space inside a conventionalsevers can be utilized effectively.

The heat dissipation module 10 of present invention utilizes heat pipes24 to transfer heat from the first to the second fin assembly, thusincreasing heat dissipation efficiency and stability of conventionalbarebone servers.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

1. A heat dissipation module comprising: a seat with a plurality of grooves, contacting a heat source; a first fin assembly with a plurality of first fins disposed on the seat, covering the grooves; a second fin assembly with a plurality of second fins disposed on a side of the first fin assembly; and a plurality of heat pipes, each heat pipe comprising a first end disposed in the grooves, covered by the first fin assembly, and a second end extending from the grooves and passing through the second fin assembly.
 2. The heat dissipation module as claimed in claim 1, wherein the first fins are parallel.
 3. The heat dissipation module as claimed in claim 1, wherein the second first fins are parallel.
 4. The heat dissipation module as claimed in claim 1, wherein the first fins are perpendicular to the heat pipes.
 5. The heat dissipation module as claimed in claim 1, wherein the second fins are perpendicular to the heat pipes.
 6. The heat dissipation module as claimed in claim 1, wherein the heat pipes are soldered in the grooves.
 7. The heat dissipation module 10 as claimed in claim 1, wherein the first fin assembly is soldered on the seat.
 8. The heat dissipation module as claimed in claim 1, wherein the second fin assembly is soldered to the second ends of the heat pipes.
 9. The heat dissipation module as claimed in claim 1, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum.
 10. A heat dissipation module comprising: a seat; a plurality of heat pipes disposed on the seat and extending from the seat, forming a plurality of cantilevered ends; a first fin assembly with a plurality of first fins, disposed on the seat and covering the heat pipes; and a second fin assembly with a plurality of second fins, secured at the cantilevered ends of the heat pipes.
 11. The heat dissipation module as claimed in claim 10, wherein the first fins are parallel.
 12. The heat dissipation module as claimed in claim 10, wherein the second first fins are parallel.
 13. The heat dissipation module as claimed in claim 10, wherein the first fins are perpendicular to the heat pipes.
 14. The heat dissipation module as claimed in claim 10, wherein the second fins are perpendicular to the heat pipes.
 15. The heat dissipation module as claimed in claim 10, wherein the heat pipes are soldered on the seat.
 16. The heat dissipation module as claimed in claim 10, wherein the first fin assembly is soldered on the seat.
 17. The heat dissipation module as claimed in claim 10, wherein the second fin assembly is soldered to the cantilevered ends of the heat pipes.
 18. The heat dissipation module as claimed in claim 10, wherein the seat, the heat pipes, the first fin assembly and the second fin assembly comprise copper or aluminum. 